The Single Best Strategy To Use For Noohapou

The POU3500 procedure presents dynamic temperature Charge of the process chamber cathode / electrode / anode and might be synchronized with any etch course of action.

Resource & TCU software calibration treatments vary exterior take a look at products not utilized consistently for verifying

Together with the POU3500, you may achieve unparalleled brings about etch effectiveness, chamber uptime, minimized cost of ownership and fab Place utilization – all although improving your approach trustworthiness.

initially Started in 1985, our organization has grown right into a acknowledged leader in supplying temperature Manage methods to the global semiconductor industry.

This exceptional technique, providing a small variety variable, low Cost-of-Ownership and Dynamic Temperature Control provided method and products engineers a different tool to optimize their temperature delicate processes.

The precision of the POU 3300 permits impartial Charge of the procedure fluid temperature towards the wafer chuck in +/- 0.one °C of established position, as well as speedy reaction time of your process enables for max wafer-to-wafer repeatability through the etch method.

All static TCUs call for excessive cooling & heating capacities because of their pretty huge system fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Management technique is a lot less than one gallon.

With our unit strategically mounted somewhere around 6 feet in the chamber, we achieve a way more correct reading through from the chuck temperature. This solution makes sure regular temperature all over the generation whole lot, leading to improved wafer-to-wafer CD uniformity.

the information pertains to a 300mm chamber temperature profile all through a high component ratio Etch procedure, working at very higher RF electric power disorders (~three.8kW). The powerful elements of this facts established are:

Dynamic Temperature Management, as applied in devices such as the LAUDA-Noah POU, is definitely an technique that senses the temperature of the method fluid coming back from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature on the supplied process fluid based on this true-time feed-back.

the info established Here's from a 200mm volume manufacturing wafer fab and Obviously illustrates the benefit of the LAUDA-Noah POU technique.

in excess of at any time, shrinking machine geometries, demanding new processes plus a really competitive setting have to have temperature Management devices that Mix fast and accurate temperature Handle with the emphasis on lowered operating fees and enhanced reliability.

Confirmed; TEs' characterize just one Portion of a chiller's layout. The switching & Command techniques utilized by a chiller will impression the TEs' reliability.

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